Roger Cook

Managing Director IC Packaging

Roger has an extensive history in all aspects of integrated circuit manufacturing and management. He held a wide variety of positions during his 30 years at Intel Corp. including process engineering, process integration engineering, quality control, yield improvement, operations management, benchmarking and strategic planning. He was the team leader for many divisional and cross-divisional improvement efforts.  He was also involved in several Intel factory start-ups, participating as part of the start-up management teams. He was a member of the Intel New Mexico Site Committee for over 15 years, setting policies and directions for the New Mexico site. He also represented Intel on the SEMATECH (international consortium) Manufacturing Methods Council for a number of years. As a factory manager, he managed a group of over 300 employees for 5 years of his career and worked in strategic positions reporting directly to a variety of Intel Vice Presidents for 10 years. In his current position at 3D Glass Solutions, Roger is involved in process development, manufacturing quality improvements, customer satisfaction and strategic planning. Roger has acted as an adviser for 6 other start-up companies. He holds both BS and MS degrees in Electrical Engineering.