President and Chief Executive Officer
Mark brings more than 25 years of senior management and high-volume manufacturing experience in the electronic components and packaging industry. Prior to joining 3DGS, Mark held several senior VP positions at Amkor Technology Inc. with a focus on creating and implementing successful strategies to penetrate new target markets, leading expansion into low-cost manufacturing services overseas, and creating strategic alliances to develop new product lines into billion-dollar revenue opportunities. Most recently, Mark held the position of Corporate VP, Global Head of New Business and Corporate Venture Capital at Henkel AG & CO.
At Henkel. Mark managed business units in their semiconductor, automotive, and consumer electronic segments. Mark was also co-founder of ChipPAC, Inc. that was spun out of Hyundai Semiconductor after achieving $200+ million in annual revenue. Earlier in his career, Mark worked for Motorola, Inc. in their cellular component manufacturing division. Mark earned his BS degree in Ceramic Science and Engineering from The Pennsylvania State University and he is the inventor or co-inventor of four electronic packaging-related patents.