Albuquerque, New Mexico — 3D Glass Solutions, Inc. (3DGS), a world-class expert on the fabrication of electronic packages and devices using photo-definable glass ceramics, announced today a joint collaboration with TE Connectivity Ltd. (NYSE: TEL), on the development of electronic interconnect devices using glass-based System-in-Package (SiP) technology.  This agreement leverages 3DGS’ patented APEX® Glass technology and its existing glass-based systems and components with TE Connectivity’s exceptional device, design, and packaging technology.

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