ALBUQUERQUE, NM – September 20, 2018 – 3D Glass Solutions, Inc. (3DGS), the world’s leading manufacturer of glass-based system-in-chip (SiP) and integrated passive devices (IPDs) for radio frequency (RF) and Internet of Things (IoT) applications, is pleased to announce the most recent patent to our growing portfolio that protects components and systems for the 5G, Millimeter Wave, Microwave and High-Speed Data Communications markets.

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