Advantages of Glass-based SiP & SoC designs

Our glass-based SiP/SoC design enable significant product differentiation. High-value system integration, combined with proven low-cost high-volume manufacturing, enables new product definitions in the SoC/SiP markets.

At the heart of our technology is the ability to manufacture precise through glass vias (on average around 60 microns in diameter) with micron-scale precision.  This small TGV size, coupled with fine-line metal redistribution layers leads to the following benefits for our customers.

  • Reduce chip size by 70% compared to PCBs
  • Up to 50% reduction in power utility
  • More than a 50% increase in wireless bandwidth
  • Wide band applications ranging from DC to 100GHz
  • Embed passive devices such as inductors into the package
  • Minimize assembly costs
  • 6 week production cycles speeds time to market

Glass-based SiP/SoC Applications

OEM glass-based System-in-Package (SiP) and System-on-Chip (SoC) devices are customized for specific applications: 

  • Telecommunication devices
  • MEMS sensors
  • Internet infrastructure components
  • Integrated photonic components
  • High-frequency, high-performance RF devices

Our APEX® Glass provides the highest systems-level integration of passive and active devices for SoC/SiP products compared to any other packaging technology in the market today.   


TGV60um PolishedCuTGVs PowerAmp
60µm diameter TGVs at 120µm pitch Polished cross-section of Cu-filled TGVs Power amplifier electronic package made in APEX® Glass

SiP & SoC Case Study

SiP & SoC in Glass

SiP/SoC case study with a leading electronics provider to dramatically shrink a popular RF communications chip while improving overall device performance.

Download the case study here.

Comparison of APEX® Glass

How does APEX® Glass stack up? read more here

APEX® vs RO4003

APEX® vs Ceramic

APEX® vs Silicon

APEX® vs All Materials