IMPROVE PERFORMANCE AND REDUCE PACKAGE SIZE

Heat spreaders and heat sinks with our unique mini pin fin design, enable the designers of LED, LCD, and other small, high-power electronic devices to build more compact packages.

Heat spreaders and heat sinks made of 100% copper can be made as small as 1 mm x 1 mm, and as thin as 200 microns; enabling truly small packages.

100% COPPER ENABLES BETTER PERFORMANCE

Copper has a higher thermal conductivity and conducts heat faster than aluminum. Therefore, the temperature across the heat spreader OR heat sink will be more uniform. With a higher volumetric heat capacity than aluminum, it takes a larger quantity of energy to raise the temperature thus smoothing out the thermal load.

Copper heat sinks and heat spreaders better match the CTE of the solder joints which reduces fatigue failure from repeated, long-term thermal cycling.

However, copper has a higher density and is traditionally more expensive than aluminum.

Heat sinks and heat spreaders from 3D Glass Solutions, with the mini pin fin design, leverage the advantages of the copper and minimize the disadvantages (weight and expense).

100% copper heat spreaders outperform copper ‘coin’ designs as the mini pin fin's internal structure enables torsion relieving stresses from thermal cycling.

Additionally, copper heat sinks and heat spreaders can be designed to integrate I/O signals within the package, enabling more functionality in a smaller footprint.

Improved Assembly Lifetime Performance

3D Glass Solutions’ heat sinks and heat spreaders offer a better match to the CTE of the solder joints.  This reduces fatigue failure from repeated, long-term thermal cycling.

Heat spreaders contain an array of high-density copper pillars in-between two solid copper plates.  This architecture allows efficient thermal transfer while enabling the assembly to bend and torsion through the thermal cycling process—saving the solder joints.

Additionally, copper heat sinks and heat spreaders can be designed to integrate I/O signals within the package, enabling more functionality in a smaller footprint.

ULTRA SMALL DESIGNS FOR ULTRA SMALL PACKAGES

50 micron mini pin fins enable effective thermal transfers of up to 100 W/m∙K. This is far superior to the single piece copper coin solution which is limited by its inherent surface area.

Legacy production methods in the past have not been able to cost-effectively produce thermally efficient AND mini heat spreaders and heat sinks until now!

CUSTOM SOLUTIONS FOR IMPROVED OUTCOMES

Each application is unique in footprint, thermal management requirements, and additional features. Contact us directly with your specific needs.

Parameters Typical Performance Limits
Size 5mm x 5mm 1mm x 1mm
Height 250 - 300 microns 200 - 500 microns
Minimum pin-fin spacing 50 - 200 microns 35 - 50 microns
Minimum pin-fin diameter 50 - 100 microns 40 microns
Materials Copper with Gold finish Copper with Gold finish