Packaging options are customizable to the application. Common packaging interconnects include SMT and wire bonded approaches.
5G and Beyond
- Frequency range 20 – 40+ GHz
- SMT design
- 3-6 poles
- Low insertion loss
- Size less than 7.5 x 4.5 mm
- 50 Ω impedance
- Bandwidths up to 40%
- Patented Air Cavity design
- High-Q with low insertion loss
- Unwanted RF parasitics are minimized
- Highly scalable lithographic process
- Fully shielded
- Frequency stable over temperature
|Passband (GHz)||27 to 29|
|Insertion Loss @ fc (dB)||2.3 dB @ 25°C|
|Attenuation||30 min @ 20000-25300 MHz
30 min @ 30200-35000 MHz
|Passband Return Loss (dB)||10 min @ 27000-28000 MHz|
|Size (LxWxH)||7.1 x 4.3 x 0.7 mm|
|Operating Temperature||-55°C to +125°C|
Electrical specifications based on typical performance at room temperature. Insertion loss shall vary ±0.5 dB over temperature.
To learn more about how 3DGS can build your advanced filter products, please contact us.