IMPROVE PERFORMANCE AND REDUCE PACKAGE SIZE

High density arrays simplify integration, alignment, and assembly. High accuracy alignments reduce assembly errors and improve assembly costs.

HIGH-VOLUME MANUFACTURING

Wafer-level production ensures high-volume production with run-to-run repeatability.

PRECISION MANUFACTURING

3D Glass Solutions’ manufacturing process ensures the accurate manufacturing of edge wraps and alignment features with micro-scale precision every time!

ELECTRICAL AND OPTICAL INTEGRATION

Electrical traces can be combined with thru-holes or edge wraps to maximize integration possibilities further reducing package sizes.

CUSTOM SOLUTIONS FOR IMPROVED OUTCOMES

Each application is unique in footprint, thermal management requirements, and additional features. Contact us directly with your specific needs.

Design Limits

Parameters Typical Performance Limits
Size 0.75mm x 0.75mm 0.25mm x 0.35mm
Height 0.35mm 0.10mm
Angular tolerances 70 - 110° (+/- 1.5°) 70 - 110° (+/- 1.0°)
Pad width 100 - 500 microns 75 - 500 microns
Spacing between pads 100 microns 75 microns
Thermal capacity 1 W / mK 50 W / mK
Assembly options Solder, Wire bond Solder, Wire bond