Albuquerque, New Mexico — 3D Glass Solutions, Inc. (3DGS), the world’s leading expert in the fabrication of electronic devices and packaging using photo-definable glass ceramics, announced today the development of high performance and high frequency circuits for radio frequency (RF) filters using 3DGS’ patented APEX® Glass-based system-in-package (SiP) solutions. The RF circuit combines glass-based High-Q wide band inductors and capacitors into a single integrated architecture capable of producing a wide variety of RF filters for frequencies up to 30GHz. This breakthrough of innovation ushers in a new era of inexpensive, high efficiency, with reduced footprint glass-based SiP solutions for existing 2.4GHz and emerging 28GHz 5G wireless communication and monolithic microwave integrated circuits (MMICs) markets.
“We are extremely excited to announce this truly disruptive technology to the RF industry. 3DGS has developed a low-cost effective solution for the rapidly expanding RF markets that overcomes limitations existing with traditional RF filters”, said Jeb Flemming, Chief Executive Officer of 3DGS. “We are also confident that our advanced glass-based enabling technology will accelerate the development of other technological product solutions for the wireless and satellite communications, radar, telemetry, consumer electronics, semiconductor, security, and defense markets as well. Our high-value system and device integration, combined with proven low-cost high-volume manufacturing, provides a significant product differentiation for our customers.”
The new inductor products substantially reduce form-factors and offer improved performance over competitive technologies. 3D Glass Solutions’ unique inductor solutions offer both high-power and high-quality factor designs for microwave and RF frequencies.
The advantages inductors from 3D Glass Solutions include:
- Inductances ranging from 1 – 16 nH
- Up to 3 Amps of current handling
- Q-Factors > 50
- Inductor thicknesses <100 microns
- Wire bonding and surface mount device assembly options
- Wafer-level packaging for cost effective manufacturing
- Micron-scale manufacturing precision ensures tight performance distribution
3D Glass Solutions is also offering new design kits featuring a standard selection of inductors to facilitate component selection for the RF engineer.