EL SEGUNDO, Calif. – June 11, 2018 – 3D Glass Solutions (3DGS) announces the release of an industry-first, glass-based RF integrated passive devices (IPDs) process design kit (PDK) specifically for NI AWR Design Environment customers. Developed in collaboration with NI AWR software experts, the 3D Glass Solutions IPD PDK enables the design of high-performance components for internet of things (IoT), LTE, 5G and satellite communications. These components are realized by using low-insertion loss matching networks and RF filters with a small footprint (less than two millimeters by two millimeters) and high-current handling.
3D Glass Solutions, Inc. (3DGS), the world’s leading manufacturer of glass-based system-in-chip (SiP) and integrated passive devices (IPDs) for radio frequency (RF) and Internet of Things (IoT) applications, is pleased to announce the appointment of Mark Popovich as its Chief Executive Officer. Jeb Flemming, Company founder, will continue to serve as Chief Technology Officer and a director of the Company.
“Today’s action is the culmination of several years of discussion, careful planning, and execution,” said Jeb Flemming. “Mark previously held the role of Strategic Advisor to 3DGS’ Board and we are all very excited to work with him in his new role to further accelerate the growth of our business. We recently identified several new product opportunities using our patented technology and I am eager to get back to my roots and focus on continuing our technology innovation. Our business outlook looks very promising and I am very excited about this change.”
Albuquerque, New Mexico — 3D Glass Solutions, Inc. (3DGS), the world’s leading manufacturer of glass-based system-in-chip (SiP) and integrated passive devices (IPDs) for radio frequency (RF) and Internet of Things (IoT) applications, is pleased to announce the appointment of Mark Perhacs as Director of Sales and Marketing.
Mark joins 3DGS with more than 25 years of sales and marketing experience and with an extensive background in RF and microwave technology markets. As a member of the Publisher’s Council for the Microwave product Digest publication, Mark also serves as an advisor for RF and microwave design and application engineers. In this new position, Mark will oversee all of the Company’s sales and marketing functions, reporting directly to Jeb Flemming, President and CEO.
Albuquerque, New Mexico — 3D Glass Solutions, Inc. (3DGS), a world-class expert on the fabrication of electronic packages and devices using photo-definable glass-ceramics, announced today the development and production of the highest efficiency 5G integrated passive devices (IPD) for radio frequency (RF) filters. These RF filters have been designed to operate as bandpass filters for frequencies at 5GHz and 28GHz with less than 1.0 dB of insertion loss.
“5G technology is expected to dramatically improve the performance of mobile networks and wireless systems in addition to enabling new products and applications in the Internet of Things (IoT), Augmented Reality (AR), and Virtual Reality (VR) markets”, said Jeb Flemming, Chief Executive Officer of 3DGS. “3DGS has developed low-cost solutions for these rapidly expanding RF markets. 3DGS’ technology overcomes the limitations that exist with traditional RF filters. The combination of smallest size, lowest insertion loss, and lowest power consumption provides a significant product differentiation for our customers.”
Albuquerque Journal · 7 Nov 2016 · 5 · Kevin Robinson-Avila, Albuquerque, New Mexico — Albuquerque startup 3D Glass Solutions Inc. has hitched a ride into the global electronics and communications markets through a new partnership with TE Connectivity Ltd.
Albuquerque, New Mexico — 3D Glass Solutions, Inc. (3DGS), a world-class expert on the fabrication of electronic packages and devices using photo-definable glass ceramics, announced today a joint collaboration with TE Connectivity Ltd. (NYSE: TEL), on the development of electronic interconnect devices using glass-based System-in-Package (SiP) technology. This agreement leverages 3DGS’ patented APEX® Glass technology and its existing glass-based systems and components with TE Connectivity’s exceptional device, design, and packaging technology.
Albuquerque, New Mexico — 3D Glass Solutions, Inc. (3DGS), the world’s leading expert in the fabrication of electronic devices and packaging using photo-definable glass ceramics, announced today the development of high performance and high frequency circuits for radio frequency (RF) filters using 3DGS’ patented APEX® Glass-based system-in-package (SiP) solutions. The RF circuit combines glass-based High-Q wide band inductors and capacitors into a single integrated architecture capable of producing a wide variety of RF filters for frequencies up to 30GHz. This breakthrough of innovation ushers in a new era of inexpensive, high efficiency, with reduced footprint glass-based SiP solutions for existing 2.4GHz and emerging 28GHz 5G wireless communication and monolithic microwave integrated circuits (MMICs) markets.
“We are extremely excited to announce this truly disruptive technology to the RF industry. 3DGS has developed a low-cost effective solution for the rapidly expanding RF markets that overcomes limitations existing with traditional RF filters”, said Jeb Flemming, Chief Executive Officer of 3DGS. “We are also confident that our advanced glass-based enabling technology will accelerate the development of other technological product solutions for the wireless and satellite communications, radar, telemetry, consumer electronics, semiconductor, security, and defense markets as well. Our high-value system and device integration, combined with proven low-cost high-volume manufacturing, provides a significant product differentiation for our customers.”
The new inductor products substantially reduce form-factors and offer improved performance over competitive technologies. 3D Glass Solutions’ unique inductor solutions offer both high-power and high-quality factor designs for microwave and RF frequencies.
The advantages inductors from 3D Glass Solutions include:
- Inductances ranging from 1 – 16 nH
- Up to 3 Amps of current handling
- Q-Factors > 50
- Inductor thicknesses <100 microns
- Wire bonding and surface mount device assembly options
- Wafer-level packaging for cost effective manufacturing
- Micron-scale manufacturing precision ensures tight performance distribution
3D Glass Solutions is also offering new design kits featuring a standard selection of inductors to facilitate component selection for the RF engineer.