• 3D Glass Solutions Announces Highest Efficiency 5G IPD RF Filters

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    3D Glass Solutions Announces Highest Efficiency 5G IPD RF Filters 

    Albuquerque, New Mexico — 3D Glass Solutions, Inc. (3DGS), a world-class expert on the fabrication of electronic packages and devices using photo-definable glass-ceramics, announced today the development and production of the highest efficiency 5G integrated passive devices (IPD) for radio frequency (RF) filters.  These RF filters have been designed to operate as bandpass filters for frequencies at 5GHz and 28GHz with less than 1.0 dB of insertion loss.

    “5G technology is expected to dramatically improve the performance of mobile networks and wireless systems in addition to enabling new products and applications in the Internet of Things (IoT), Augmented Reality (AR), and Virtual Reality (VR) markets”, said Jeb Flemming, Chief Executive Officer of 3DGS.  “3DGS has developed low-cost solutions for these rapidly expanding RF markets.  3DGS’ technology overcomes the limitations that exist with traditional RF filters.  The combination of smallest size, lowest insertion loss, and lowest power consumption provides a significant product differentiation for our customers.”

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  • Startup's Partnership Opens Doors to Markets

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    Startup’s Partnership Opens Doors to Markets 

    Albuquerque Journal · 7 Nov 2016 · 5 · Kevin Robinson-Avila, Albuquerque, New Mexico — Albuquerque startup 3D Glass Solutions Inc. has hitched a ride into the global electronics and communications markets through a new partnership with TE Connectivity Ltd.

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  • TE Connectivity & 3DGS Announce Joint Development Agreement

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    TE Connectivity and 3D Glass Solutions Announce a Joint Collaboration on Development of Electronic Interconnect Devices Using Glass-Based System-in-Package (SiP) Technology 

    Albuquerque, New Mexico — 3D Glass Solutions, Inc. (3DGS), a world-class expert on the fabrication of electronic packages and devices using photo-definable glass ceramics, announced today a joint collaboration with TE Connectivity Ltd. (NYSE: TEL), on the development of electronic interconnect devices using glass-based System-in-Package (SiP) technology.  This agreement leverages 3DGS’ patented APEX® Glass technology and its existing glass-based systems and components with TE Connectivity’s exceptional device, design, and packaging technology.

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  • Announcing Breakthrough Integrated RF Filters in Glass

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    3D Glass Solutions Announces Breakthrough Development of High Performance and High Frequency Circuits for RF Filters Using Glass-Based System-in-Package (SiP) Solutions

    Albuquerque, New Mexico — 3D Glass Solutions, Inc. (3DGS), the world’s leading expert in the fabrication of electronic devices and packaging using photo-definable glass ceramics, announced today the development of high performance and high frequency circuits for radio frequency (RF) filters using 3DGS’ patented APEX® Glass-based system-in-package (SiP) solutions. The RF circuit combines glass-based High-Q wide band inductors and capacitors into a single integrated architecture capable of producing a wide variety of RF filters for frequencies up to 30GHz. This breakthrough of innovation ushers in a new era of inexpensive, high efficiency, with reduced footprint glass-based SiP solutions for existing 2.4GHz and emerging 28GHz 5G wireless communication and monolithic microwave integrated circuits (MMICs) markets.

    “We are extremely excited to announce this truly disruptive technology to the RF industry. 3DGS has developed a low-cost effective solution for the rapidly expanding RF markets that overcomes limitations existing with traditional RF filters”, said Jeb Flemming, Chief Executive Officer of 3DGS. “We are also confident that our advanced glass-based enabling technology will accelerate the development of other technological product solutions for the wireless and satellite communications, radar, telemetry, consumer electronics, semiconductor, security, and defense markets as well. Our high-value system and device integration, combined with proven low-cost high-volume manufacturing, provides a significant product differentiation for our customers.”

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  • Glass-based SiP/SoC devices using photo-sensitive glass ceramics at IMAPS

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    Jeb Flemming will be presenting the topic of glass-based SiP/SoC devices using photo-sensitive glass ceramics at the 49th International Microelectronics Assembly and Packaging Society (IMAPS) Symposium in Pasadena, California, on October 12, 2016.

  • New Inductor Products from 3D Glass Solutions

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    3D Glass Solutions launches new High-Q inductors at IMS (IEEE International Microwave Symposium).

    The new inductor products substantially reduce form-factors and offer improved performance over competitive technologies. 3D Glass Solutions’ unique inductor solutions offer both high-power and high-quality factor designs for microwave and RF frequencies.

    The advantages inductors from 3D Glass Solutions include:

    • Inductances ranging from 1 – 16 nH
    • Up to 3 Amps of current handling
    • Q-Factors > 50
    • Inductor thicknesses <100 microns
    • Wire bonding and surface mount device assembly options
    • Wafer-level packaging for cost effective manufacturing
    • Micron-scale manufacturing precision ensures tight performance distribution

    3D Glass Solutions is also offering new design kits featuring a standard selection of inductors to facilitate component selection for the RF engineer.

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  • Gearing Up for Mass Production

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    3D Glass Solutions was featured recently in an article in the Albuquerque Journal. Read the article here.

  • Kirby Jefferson Joins 3D Glass Solutions Board of Advisors

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    3D Glass Solutions is proud to announce the addition of Kirby Jefferson to our Board of Advisors. Mr. Jefferson joins 3D Glass Solutions after spending the last 35 years with Intel Corporation in the applied technology and high-tech manufacturing industries.

    “We are excited to have such a strong leader with such a large amount of experience and industry knowledge as a new Advisor to our staff,” said Jeb Flemming, MS, MBA, Founder and CEO of 3D Glass Solutions. “We know that he will serve our company well and ensure that we continue to provide the best products and service to our customers.”

    From 2013–2015, Mr. Jefferson served as Vice President of the Technology and Management Group as well as General Manager of Intel’s Fab 11X complex in Rio Rancho.  He and his team fabricated many of Intel’s state-of-the-art semiconductor products with an emphasis in the mobile market segments.  During his tenure, Intel recognized the New Mexico site with it’s highest team award, the “Intel Quality Award”. Prior to this position, he was the General Manager at Intel’s Fab 68 plant in Dalian, China, where he was responsible for bringing Fab 68 from initial concept to full production.  In 2012, Intel awarded the “Intel Quality Award” to Fab 68 which was the first time Intel had done so to a startup factory.

    He joined Intel in 1980 as a production supervisor at the company’s Fab 2 facility in Santa Clara, CA.  Overall during his Intel tenure, he has been involved in seven factory startups, holding a variety of jobs in manufacturing and engineering.  He currently serves on the Board of the United Way of Central New Mexico, Presbyterian Health Care services, the Steering Council for Mission: Graduate and on the CNM Ingenuity Board.  He is a native New Mexican, attended public school in Albuquerque, and earned his BS and MBA degrees from the University of New Mexico.