The International Microwave Symposium (IMS), the premier microwave and RF industry event, will play host to 3D Glass Solutions’ (3DGS) unique 3D RF passive device design and manufacturing technology from June 2 to 7 at the Massachusetts Convention Center in Boston. Visit the company in booth 781 to learn more about its transformative approach to enabling next-generation 5G communication standards with high–frequency performance that is superior to conventional solutions. Learn more about the company here.
Contact: Tom Bianchi
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